State-of-the-art equipment from Japan and advanced multi-line cutting technique are applied to guarantee high cutting efficiency and evenness of quality and thickness on wafers . We can also carry out wafer processing in various sizes and thicknesses for clients according to their requirements.
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ITEM
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PARAMETER
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Spec |
125mm×125mm
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156mm×156mm
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Type
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P
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Dimension
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125±0.5mm
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156±0.5mm
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|
Diameter
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150±0.5mm
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165±0.5mm
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|
Thickness
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220±15μm
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Minority carrier time
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≥10μs
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|
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Resistivity
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0.5～3Ω·cm ， 3～6Ω·cm
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|
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Cutting method
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Wire-cutting
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|
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Crystal orientation
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(100) ±3°
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|
 |
 |
Sample Display
Solar modules of our own products are displayed in our office in Frankfurt am Main. We are pleased of your visit.
China, the Market of Future
Besides supplying solar products we also offer manufacturers and suppliers of solar products with the attractive possibility to mark out their innovation and technologies in China through us.